Mea hana ma'amau metala Foam Future Materials - Copper Foam – Beihai
Manufactur standard Metal Foam Future Materials - Copper Foam – Beihai Details:
Hōʻike huahana
Ua hoʻohana nui ʻia ʻo Copper Foam e like me ka hoʻomākaukau ʻana i ka mea lawe ʻole i ka pālolo, substrate electrode o ka pā lithium ion a i ʻole wahie, cellcatalyst carrier a me nā mea pale electromagnetic. ʻO ka pahu keleawe ka mea kumu i hoʻohana ʻia ma ke ʻano he electrode o ka pākaukau, me kekahi mau mea maikaʻi.
Hiʻona Huahana
1) Loaʻa nā waiwai wela maikaʻi loa o ka copper foam, hiki ke hoʻohana nui ʻia i nā ʻāpana kaʻa / uila a me ka uila o ka radiation conduction wela.
2) ʻO ka pahu keleawe ma muli o kāna conductivity uila maikaʻi loa, ʻo kāna pākaukau nickel-zinc a me ka hoʻohana ʻana i nā mea electrode no ka capacitor pālua pālua e pili pū ana i ka nānā ʻana o ka ʻoihana.
3) ma muli o ke ʻano o ke ʻano o ke kino o ke kanaka, ʻo ka kānana ʻana i nā mea o ke keleawe he lāʻau lapaʻau maikaʻi loa a me ka hoʻomaʻemaʻe wai.
Huahana Huahana
| Pepa pahu keleawe | |
| Nui Pore | 5PPI a 80PPI |
| ʻO ka mānoanoa | 0.25g/m3 a i 1.00g/cm3 |
| Porosity | 90% a 98% |
| mānoanoa | 5mm a 30mm |
| laula kiʻekiʻe | 500mm x 1000mm |
| Maʻiʻo hapa | ||||||
| ʻElemu | Me | In | ʻO Fe | S | C | A |
| alakaʻi (ppm) | Kaulike | 0.5-5% | ≤100 | ≤80 | ≤100 | ≤50 |
Hale hana
Wahi noi
1. Kemimi 'enekinia Field: catalyst a me kāna mea lawe, kānana waena, waena ma ka separator.
2. ʻEnekinia Thermal ʻOihana: nā mea hoʻoheheʻe, nā mea hoʻoheheʻe wela kiʻekiʻe, nā mea kānana ʻoihana, nā mea hoʻonaninani kiʻekiʻe.
3. Mea Hana Hana: Silencer, Vibration absorption, Buffer electromagnetic shielding, stealth technology, flame retardant, thermal insulation, etc.
4. Pākuʻi Electrode Material: Hoʻohana ʻia ia i nā mea hoʻohālikelike uila uila e like me nickel-zinc, nickel-hydrogen battery a me ka uila pālua pālua.
5. Māmā: ʻO nā kaʻa māmā, māmā ke kaumaha o nā moku, a me nā hale māmā.
6. Mea hoʻopaʻa ʻana: Mea hoʻemi hoʻohaʻahaʻa i ke kaomi no ke ana kaomi.
Nā kiʻi kikoʻī huahana:
Alakaʻi Huahana Pili:
Hoʻohiki kā mākou hui i nā mea kūʻai aku me nā huahana papa mua a me nā hoʻonā a me ka lawelawe ma hope o ke kūʻai ʻana. Hoʻokipa maikaʻi mākou i kā mākou mau mea kūʻai maʻamau a me nā mea hou e hui pū me mākou no Manufactur standard Metal Foam Future Materials - Copper Foam - Beihai , E hāʻawi aku ka huahana i nā wahi a pau o ka honua, e like me: Libya, Madrid, Iran, Hoʻohana nuiʻia nā huahana nui o kā mākou hui. a puni ka honua; 80% o kā mākou huahana i lawe ʻia aku i ʻAmelika Hui Pū ʻIa, Iapana, ʻEulopa a me nā mākeke ʻē aʻe. ʻO nā mea a pau e hoʻokipa maikaʻi i nā malihini e hele mai e kipa i kā mākou hale hana.
Na Atalanta mai Czech repubalika - 2017.09.26 12:12 Ma keʻano he mea kahiko o kēiaʻoihana, hiki iā mākou ke'ōlelo e hiki i ka hui ke alakaʻi i kaʻoihana, koho pono iā lākou.
Na Agatha mai Czech Republic - 2018.06.28 19:27 Nā huahana pili
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