OEM/ODM Mea Hoʻolako Electrodeposition Of Metallic Foam - Copper Foam - Beihai
OEM/ODM Mea Hoʻolako Electrodeposition Of Metallic Foam - Copper Foam – Beihai Detail:
Hōʻike huahana
Ua hoʻohana nui ʻia ʻo Copper Foam e like me ka hoʻomākaukau ʻana i ka mea lawe ʻole i ka pālolo, substrate electrode o ka pā lithium ion a i ʻole wahie, cellcatalyst carrier a me nā mea pale electromagnetic. ʻO ka pahu keleawe ka mea kumu i hoʻohana ʻia ma ke ʻano he electrode o ka pākaukau, me kekahi mau mea maikaʻi.
Hiʻona Huahana
1) Loaʻa nā waiwai wela maikaʻi loa o ka copper foam, hiki ke hoʻohana nui ʻia i nā ʻāpana kaʻa / uila a me ka uila o ka radiation conduction wela.
2) ʻO ka pahu keleawe ma muli o kāna conductivity uila maikaʻi loa, ʻo kāna pākaukau nickel-zinc a me ka hoʻohana ʻana i nā mea electrode no ka capacitor pālua pālua e pili pū ana i ka nānā ʻana o ka ʻoihana.
3) ma muli o ke ʻano o ke ʻano o ke kino o ke kanaka, ʻo ka kānana ʻana i nā mea o ke keleawe he lāʻau lapaʻau maikaʻi loa a me ka hoʻomaʻemaʻe wai.
Huahana Huahana
| Pepa pahu keleawe | |
| Nui Pore | 5PPI a 80PPI |
| ʻO ka mānoanoa | 0.25g/m3 a i 1.00g/cm3 |
| Porosity | 90% a 98% |
| mānoanoa | 5mm a 30mm |
| laula kiʻekiʻe | 500mm x 1000mm |
| Maʻiʻo hapa | ||||||
| ʻElemu | Me | In | ʻO Fe | S | C | A |
| alakaʻi (ppm) | Kaulike | 0.5-5% | ≤100 | ≤80 | ≤100 | ≤50 |
Hale hana
Wahi noi
1. Kemimi 'enekinia Field: catalyst a me kāna mea lawe, kānana waena, waena ma ka separator.
2. ʻEnekinia Thermal ʻOihana: nā mea hoʻoheheʻe, nā mea hoʻoheheʻe wela kiʻekiʻe, nā mea kānana ʻoihana, nā mea hoʻonaninani kiʻekiʻe.
3. Mea Hana Hana: Silencer, Vibration absorption, Buffer electromagnetic shielding, stealth technology, flame retardant, thermal insulation, etc.
4. Pākuʻi Electrode Material: Hoʻohana ʻia ia i nā mea hoʻohālikelike uila uila e like me nickel-zinc, nickel-hydrogen battery a me ka uila pālua pālua.
5. Māmā: ʻO nā kaʻa māmā, māmā ke kaumaha o nā moku, a me nā hale māmā.
6. Mea hoʻopaʻa ʻana: Mea hoʻemi hoʻohaʻahaʻa i ke kaomi no ke ana kaomi.
Nā kiʻi kikoʻī huahana:
Alakaʻi Huahana Pili:
ʻO kā mākou mau limahana i loko o ka ʻuhane o ka "hoʻomaikaʻi mau a me ka maikaʻi", a me ka hoʻohana ʻana i nā waiwai kiʻekiʻe kiʻekiʻe, ka uku kūpono a me nā lawelawe loea ma hope o ke kūʻai aku, ke hoʻāʻo nei mākou e lanakila i kēlā me kēia mea kūʻai aku no ka OEM / ODM Supplier Electrodeposition Of Metallic Foam - Copper Foam - Beihai , E hoʻolako ka huahana i nā wahi āpau o ka honua, e like me: moldova, Kuala Lumpur, Dubai, Pono maoli i kekahi o ia mau mea e hoihoi iā ʻoe, e ʻike pono e ae mai oe ia makou e ike. E hauʻoli mākou e hāʻawi iā ʻoe i kahi ʻōlelo i ka loaʻa ʻana o nā kikoʻī kikoʻī. Loaʻa iā mākou kā mākou loea R&D loea e hoʻokō i kekahi o nā koi, Manaʻo mākou i ka loaʻa koke ʻana o kāu mau nīnau a ke manaʻo nei e loaʻa ka manawa e hana pū me ʻoe i loko o ka wā e hiki mai ana. Welina mai e nānā i kā mākou hui.
Na Mona mai Pokukala - 2018.11.04 10:32 He kūpaʻa a hilinaʻi ka maikaʻi o kēia mea hoʻolako, e like me nā koi o kā mākou hui e hoʻolako i nā waiwai i kūpono i kā mākou mau koi.
Na Kevin Ellyson mai Mali - 2017.09.30 16:36 Nā huahana pili
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