OEM/ODM Mea Hoʻolako Electrodeposition Of Metallic Foam - Copper Foam - Beihai
OEM/ODM Mea Hoʻolako Electrodeposition Of Metallic Foam - Copper Foam – Beihai Detail:
Hōʻike huahana
Ua hoʻohana nui ʻia ʻo Copper Foam e like me ka hoʻomākaukau ʻana i ka mea lawe ʻole i ka pālolo, substrate electrode o ka pā lithium ion a i ʻole wahie, cellcatalyst carrier a me nā mea pale electromagnetic. ʻO ka pahu keleawe ka mea kumu i hoʻohana ʻia ma ke ʻano he electrode o ka pākaukau, me kekahi mau mea maikaʻi.
Hiʻona Huahana
1) Loaʻa nā waiwai wela maikaʻi loa o ka copper foam, hiki ke hoʻohana nui ʻia i nā ʻāpana kaʻa / uila a me ka uila o ka radiation conduction wela.
2) ʻO ka pahu keleawe ma muli o kāna conductivity uila maikaʻi loa, ʻo kāna pākaukau nickel-zinc a me ka hoʻohana ʻana i nā mea electrode no ka capacitor pālua pālua e pili pū ana i ka nānā ʻana o ka ʻoihana.
3) ma muli o ke ʻano o ke ʻano o ke kino o ke kanaka, ʻo ka kānana ʻana i nā mea o ke keleawe he lāʻau lapaʻau maikaʻi loa a me ka hoʻomaʻemaʻe wai.
Huahana Huahana
| Pepa pahu keleawe | |
| Nui Pore | 5PPI a 80PPI |
| ʻO ka mānoanoa | 0.25g/m3 a i 1.00g/cm3 |
| Porosity | 90% a 98% |
| mānoanoa | 5mm a 30mm |
| laula kiʻekiʻe | 500mm x 1000mm |
| Maʻiʻo hapa | ||||||
| ʻElemu | Me | In | ʻO Fe | S | C | A |
| alakaʻi (ppm) | Kaulike | 0.5-5% | ≤100 | ≤80 | ≤100 | ≤50 |
Hale hana
Wahi noi
1. Kemimi 'enekinia Field: catalyst a me kāna mea lawe, kānana waena, waena ma ka separator.
2. ʻEnekinia Thermal ʻOihana: nā mea hoʻoheheʻe, nā mea hoʻoheheʻe wela kiʻekiʻe, nā mea kānana ʻoihana, nā mea hoʻonaninani kiʻekiʻe.
3. Mea Hana Hana: Silencer, Vibration absorption, Buffer electromagnetic shielding, stealth technology, flame retardant, thermal insulation, etc.
4. Pākuʻi Electrode Material: Hoʻohana ʻia ia i nā mea hoʻohālikelike uila uila e like me nickel-zinc, nickel-hydrogen battery a me ka uila pālua pālua.
5. Māmā: ʻO nā kaʻa māmā, māmā ke kaumaha o nā moku, a me nā hale māmā.
6. Mea hoʻopaʻa ʻana: Mea hoʻemi hoʻohaʻahaʻa i ke kaomi no ke ana kaomi.
Nā kiʻi kikoʻī huahana:
Alakaʻi Huahana Pili:
E hana mākou i nā hana āpau a me ka hana ikaika i mea maikaʻi a maikaʻi loa, a e wikiwiki i kā mākou mau ala no ke kū ʻana i loko o ke kūlana o nā ʻoihana kiʻekiʻe a me nā ʻenehana kiʻekiʻe no ka OEM/ODM Mea Hoʻolako Electrodeposition Of Metallic Foam - Copper Foam - Beihai, E hoʻolako ka huahana i nā wahi āpau o ka honua, e like me: Philippines, Kenya, Nepal, Inā hāʻawi ʻoe iā mākou i kahi papa inoa o nā huahana āu e makemake ai, me nā hana a me nā hiʻohiʻona, hiki iā mākou ke hoʻouna aku iā ʻoe i nā huaʻōlelo. E ʻoluʻolu e leka uila pololei iā mākou. ʻO kā mākou pahuhopu, ʻo ia ka hoʻokumu ʻana i nā pilina ʻoihana no ka wā lōʻihi a loaʻa i kekahi me nā mea kūʻai aku i loko a i waho. Manaʻo mākou i ka loaʻa koke ʻana o kāu pane.
Na Claire mai Netherlands - 22.06.2017 12:49 ʻO kēia kahi mea hoʻolako Kina ʻoihana a me ka ʻoiaʻiʻo, mai kēia manawa ua aloha mākou i ka hana Kina.
Na Bernice mai Wakinekona - 2017.07.07 13:00 Nā huahana pili
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