99.9% Maʻemaʻe Porous Metal Foam kālā

Hōʻike huahana
ʻO ke kālā Foam, ʻo kona microstructure he ʻano ʻekolu-dimensional pore hāmama, maikaʻi ka mīkini a me ka hoʻoili waiwai. ʻO kona nui pore, porosity, mānoanoa mea (hiki ke hana ʻia me ka ultra-thin structure, e pili ana i 0.1 mm) a hiki ke hoʻolālā ʻia a hana ʻia e like me nā koi noi a ka mea hoʻohana o ke kālā foam i hana ʻia me ka nano a i ʻole micron-level kala pauka, ʻO ke kālā kālā ke kuleana o ke kālā nano.

Huahana Huahana

Pili no ka Conductive Electrode Substrate.

Palapala noi
Hoʻohana nui ʻia ka catalyst kala i ka ʻaila, kemika a me nā ʻoihana lāʻau. ʻO ke kālā Foam he ʻano hou o nā mea hana, me ka porosity kiʻekiʻe, ka nui kikoʻī kikoʻī kikoʻī, ka permeability maikaʻi a me nā ʻano ʻē aʻe, me ka hoʻohana ʻana iā ia e like me ka catalyst loaʻa nā pono o ka hana kiʻekiʻe, kūpaʻa maikaʻi, koho maikaʻi a pēlā aku, ʻo ia ka hoʻololi kūpono. o ke kalakala kala e noho nei. A hoʻohana ʻia ia i ka hana ʻana o formaldehyde e hoʻololi i ke kālā electrolytic kahiko a me nā catalysts kālā pumice. Hōʻike nā hualoaʻa noiʻi i ka selectivity o ke kala hupa catalyst mea e like me ka kiʻekiʻe e like me 90 ~ 96%, i oi aku i ka kuʻuna electrolytic kala catalyst e 2 ~ 5%, a oi aku i ka kalepa kala pumice catalyst me ka hapa nui o 40% e 5 ~ 7. %, a hiki ke ola o ka lawelawe ma mua o 1 makahiki.
Loaʻa i ke kālā Foam ka conductivity thermal maikaʻi loa, ʻo ke kālā ka conductivity thermal maikaʻi loa o ka metala, conductivity thermal o 418.6 W / (mK), hiki ke hoʻohana ʻia no nā mea uila / uila, nā mea uila semiconductor e pili ana i nā lako nui e pono ai no ka wikiwiki a me ka maikaʻi. conductivity a me ka wela wela.