No hea mai ka huʻa nikela?

ʻĀpana nikelahe mea i hoohana iahana i nā electrodes pākaukau,ʻO ke ʻano hana hana nickel foam material: mua conductive polyurethane sponge, a laila electrodeposition, a hope sintering.

Ma kēia kaʻina hana, hoʻohana maʻamau ka electroplating i ka plating kemikala, electroplating conductive adhesive a me ka vacuum plating ʻekolu mau ʻano; hiki ke hoʻohana i ka electrodeposition i ka sulfate a i ʻole sulfamate nickel plating; ʻO ke kumu o ke kaʻina hana sintering, ʻo ia ka puhi ʻana i ka sponge polyurethane i ka lewa i loko o kahi ea hoʻemi hydrogen no ka hoʻohaʻahaʻa sintering o nā ʻano ʻelua, kahi i puhi ai ka ea i ka sponge polyurethane me ka hoʻohana ʻana i ka oxidation o 300 ~ 700 ℃ decarburization; i ka 800 ~ 1000 ℃ hydrogen ho'ēmi i ka lewa no 30 ~ 60 minuke no ka sintering ho'ēmi, ka emi ho'ēmi 'ana i ka ammonia decomposition kinoea me ka decomposition kinoea hoʻohana o 0.8 ~ 1.2 L / g (0.8 ~ 1.2 lita o ka ammonia decomposition kinoea no ka gram o nickel) .

Pili kēia ʻano hana i ke ʻano o ka hoʻomākaukau ʻana i ka nickel foam mai ka polyurethane sponge ma ka conductivization,electrodeposition a me ka sintering, Hōʻike ʻia i ka ʻanuʻu sintering he electrodeposition pyrolytic ponoʻī o ka polyurethane foam i loko o kahi ea hoʻohaʻahaʻa, kahi e hoʻohaʻahaʻa ai ka lewa he ammonia decomposition kinoea, ʻo ka hoʻohaʻahaʻa ʻana i ka mahana he 400-1000 ° C, ʻo ka manawa hoʻemi he 30-60 mau minuke, a me ka ʻO ka hoʻohana ʻana i ke kinoea decomposition he 0.4-0.8 L/g. ʻO ke kinoea decomposition Ammonia (ka hoʻohana ʻana o 0.4-0.8 L/g o ka nickel no ka gram). 0.4-0.8 L o ke kinoea decomposition ammonia) he hui ia o ka nitrogen a me ka hydrogen me ka lakene o 1:3.

ʻO ke ʻano hana ʻana i loko o ka lewa hoʻemi hydrogen, me ka electrodeposition oʻūhā nikelaloaʻa ka polyurethane sponge pololei pyrolysis sintering, kalapona a me ka hydrogen, ka hopena i ke kinoea hydrocarbons, e like me CH4, C2H6, hiki i kēia kaʻina gasification ke hana i ka graphite i loko o ke kino porous o ka C cleaner removal.